Daniel Böck
Department of Embedded Systems
University of Applied Sciences Technikum Wien
Austria
Biography
Daniel Böck attended the HTBL-Hollabrunn and started his electronics engineering education at the University of Applied Scinces Technikum Wien in 2014. In 2017 he joined the Josef Ressel Center for Verification of Embedded Computimng Systems (VECS) where he works in close collaboration with Loytec electronics GmbH.
Research Interest
Building Automation, Embedded Software Design
