Smart Modular Technologies
With 25 years of engineering, program, and design management experience primarily in the computer memory market, Mike Rubino has been with SMART since 1999. As vice president of engineering, he is responsible for all memory product design, test development, documentation control, NPI, failure analysis, customer solution definition, BOM engineering, and new technology evaluation. Previous to joining the company, Mike gained extensive career development and engineering experience at IBM, Burroughs Corp, Schenck Trebel Corp., and Grumman Aerospace. He holds a BS in Electrical Engineering from R.I.T. (Rochester, NY) and a Master's in Electrical Engineering from Syracuse University (Syracuse, NY).