T. J. Tseng
Chairman of the Board
Asia Pacific Microsystems Inc.
China
Biography
Mr. Tseng is also the chairman of Unimicron Corporation, the largest PCB substrate company in the world. In 2007, Unimicron Corporation became a major share holder of APM, and transformed it into one of the world's largest independent MEMS foundries. Before Unimicron, Mr. Tseng served as senior vice president in United Microelectronics Corporation (UMC) and was the chairman of Taiwan Printed Circuit Association. Mr. Tseng holds a master degree in physics from the National Tsing Hua University in Taiwan and was elected as the distinguished alumnus of the National Tsing Hua University in 2009.
Research Interest
Mr. Tseng is also the chairman of Unimicron Corporation, the largest PCB substrate company in the world. In 2007, Unimicron Corporation became a major share holder of APM, and transformed it into one of the world's largest independent MEMS foundries. Before Unimicron, Mr. Tseng served as senior vice president in United Microelectronics Corporation (UMC) and was the chairman of Taiwan Printed Circuit Association. Mr. Tseng holds a master degree in physics from the National Tsing Hua University in Taiwan and was elected as the distinguished alumnus of the National Tsing Hua University in 2009.