Wang Xuefang
Professor
School of Mechanical Science and Engineering
Huazhong University of Science and Technology
China
Biography
Wang Xuefang is associate professor for School of Mechanical Science and Engineering,Huazhong University of Science and Technology, China. Mainly engaged in researches such as MEMS chips, vacuum/airtight packaging technology, 3D packaging technology based on TSV, etc. Successively presided over the projects such as National Natural Science Funds, special MEMS projects in 863 plan, etc. Developed pressure sensor chip, independently developed the vacuum/airtight packaging equipment applied in microelectronic devices.
Research Interest
MEMS chips, vacuum/airtight packaging technology, 3D packaging technology based on TSV, etc.
Publications
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Shengwei Jiang, Shuai Shi, Xuefang Wang. Nanomechanics and vibration analysis of graphene sheets via a 2D plate model. Journal of Physics D: Applied Physics. 47(2014) 045104. (Corresponding author)
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Shuai Shi, Xuefang Wang, Chunlin Xu, Jiaojiao Yuan, Jing Fang, Sheng Liu. Simulation and fabrication of two Cu TSV electroplating methods for wafer level 3D integrated circuits packaging. Sensors and Actuators A: Physical. 203(2013) 52–61. (Corresponding author)
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Xuefang Wang, Chuan Liu, Zhuo Zhang, Sheng Liu, Xiaobin Luo. A micro-machined Pirani gauge for vacuum measurement of ultra-small sized vacuum packaging. Sensors and Actuators A: Physical. 161(2010) 108–113.
