Yecheng Cai
MS
Department of Mechatronic Engineering
Institute of Technology, Harbin
China
Biography
Yecheng Cai working in Department of Mechatronic Engineering at Institute of Technology, Harbin
Research Interest
Numerical Simulation, Computational Fluid Dynamics, Heat Transfer, XFEM, Heating, Semiconductor Laser, Finite Element Analysis, Finite Element Method
Publications
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Laser cutting silicon-glass double layer wafer with laser induced thermal-crack propagation
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Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation
