He Wei
Professor
Electronic Science and Technology
University of Electronic Science and Technology of China
China
Biography
2001.11 up to now Professor, Director of Department of Applied Chemistry, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China 2000.11-2001.11 Visiting Professor in Department of Chemistry, University of Florence, Italy 2000.11- 1999.7 Professor, Director of Department of Applied Chemistry, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China 1999.7 – 1992.9 Vice Professor of Department of Applied Chemistry, University of Electronic Science and Technology of China 1990.9- 1992.9 Visiting Scholar in Department of Chemistry, University of Florence, Italy 1987.5-1992.9 Teacher of Department of Applied Chemistry, University of Electronic Science and Technology of China
Research Interest
Printed Circuit Technology, Printed electronics as well as Applied Electrochemistry and Electronic Chemicals
Publications
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Linxian Ji, Shouxu Wang, Chong Wang, Guoqin Chen, Yuanming Chen, Wei He, Tan Ze. Improved uniformity of conformal through-Hole copper electrodeposition by revision of plating cell configuration[J]. Journal of The Electrochemical Society, 2015, 162(12): D575-D583
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Jianhui Lin , Chong Wang , Shouxu Wang , Yuanming Chen, Wei He , Dingjun Xiao.Initiation electroless nickel plating by atomic hydrogen for PCB final finishing. Chemical Engineering Journal 306 (2016) 117–123
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Zhihua Tao, Wei He,Shouxu Wang,Xuemei He,Cheng Jiao, and Dingjun Xiao. Synergistic Effect of Different Additives on Microvia Filling in an Acidic Copper Plating Solution. Journal of The E lectrochemical Society, 163 (8) D379-D384 (2016)12
