Jai K. Hakhu

Biography

Dr. Jai K. Hakhu, Ph.D., serves as the Chief Executive Officer and President of RC International. Dr. Hakhu serves as the President of Lithography Group at KLA-Tencor MIE GmbH. He is responsible for the operations of the KLA-Tencor MIE GmbH. He serves as an Executive Corporate Officer of Nano Green Technology, Inc. He serves as the Chief Executive Officer and President of Horiba International Corporation (USA) and President of Horiba Abx SAS - France at Horiba Ltd. He also serves as the President and Chief Executive Officer at R.C. International. He serves as Member of the Management Board and President of Litho-Group at Vistec Electron Beam GmbH. He serves as an Executive Corporate Officer of Horiba, Ltd. and served as its Senior Managing Executive Officer. Dr. Hakhu also advises on potential future investments in semiconductors and other related sectors. Dr. Hakhu served as Senior Advisor and Operating Executive at Golden Gate Capital and works closely with its existing semiconductor portfolio companies. He is a 28-year-veteran of the semiconductor industry. Dr. Hakhu served as a Corporate Vice President and General Manager at Intel Corporation since January 2005. He oversaw Intel Corp.’s worldwide capital development and procurement, automation, decision support technologies and knowledge management initiatives. Dr. Hakhu joined Intel in 1997 and was based in Santa Clara. He served as a Vice President at Rockwell International and Varian Semiconductor Equipment Associates Inc. He served at Rockwell Automation Inc. He has been the Chairman of HORIBA International Corporation (USA) at Horiba Ltd. since April 2010. He serves as a Director of Vistec Semiconductor Systems. He has been a Director of Lantiq Deutschland GmbH since 2009. He served as a Director of Multigig, Inc. D. Hakhu holds a bachelor's degree in Physics, Chemistry, Math and English from J & K University in India; a bachelor's degree in Electronics Communication Engineering from the Indian Institute of Science; a master's degree in Solid State Electronics from the University of Roorkee in India; and a Ph.D in Electrical Engineering from the University of California, Irvine.

Research Interest

Dr. Jai K. Hakhu, Ph.D., serves as the Chief Executive Officer and President of RC International. Dr. Hakhu serves as the President of Lithography Group at KLA-Tencor MIE GmbH. He is responsible for the operations of the KLA-Tencor MIE GmbH. He serves as an Executive Corporate Officer of Nano Green Technology, Inc. He serves as the Chief Executive Officer and President of Horiba International Corporation (USA) and President of Horiba Abx SAS - France at Horiba Ltd. He also serves as the President and Chief Executive Officer at R.C. International. He serves as Member of the Management Board and President of Litho-Group at Vistec Electron Beam GmbH. He serves as an Executive Corporate Officer of Horiba, Ltd. and served as its Senior Managing Executive Officer. Dr. Hakhu also advises on potential future investments in semiconductors and other related sectors. Dr. Hakhu served as Senior Advisor and Operating Executive at Golden Gate Capital and works closely with its existing semiconductor portfolio companies. He is a 28-year-veteran of the semiconductor industry. Dr. Hakhu served as a Corporate Vice President and General Manager at Intel Corporation since January 2005. He oversaw Intel Corp.’s worldwide capital development and procurement, automation, decision support technologies and knowledge management initiatives. Dr. Hakhu joined Intel in 1997 and was based in Santa Clara. He served as a Vice President at Rockwell International and Varian Semiconductor Equipment Associates Inc. He served at Rockwell Automation Inc. He has been the Chairman of HORIBA International Corporation (USA) at Horiba Ltd. since April 2010. He serves as a Director of Vistec Semiconductor Systems. He has been a Director of Lantiq Deutschland GmbH since 2009. He served as a Director of Multigig, Inc. D. Hakhu holds a bachelor's degree in Physics, Chemistry, Math and English from J & K University in India; a bachelor's degree in Electronics Communication Engineering from the Indian Institute of Science; a master's degree in Solid State Electronics from the University of Roorkee in India; and a Ph.D in Electrical Engineering from the University of California, Irvine.