Ricky S W Lee
Chair Professor of Mechanical and Aerospace Engine
Electronic Packaging, Nano Technology, Microsystems, Solid M
The Hong Kong University of Science and Technology
Hong Kong
Biography
Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University. Currently he is Professor of Mechanical and Aerospace Engineering and Director of Center for Advanced Microsystems Packaging at the Hong Kong University of Science & Technology. He also serves as Director of HKUST Shenzhen Electronic Materials & Packaging Laboratory. In addition, Ricky is Editor-in-Chief of IEEE Transactions on Components & Packaging Technologies.
Research Interest
Flip Chip Technologies and Wafer-Level Chip Scale Packaging; Through Silicon Vias (TSV) and 3D Packaging; Passive Alignment of Optical Fibers; LED Packaging and Solid State Lighting; Lead-free Soldering and Solder Joint Reliability; Computational Modeling and Stress Analysis.
