Madhav Datta

Biography

Dr. Madhav Datta is the Chairman of ACIRI and a Distinguished Professor in the department of Chemical Engineering and Materials Science. He has over 40 years of industrial and academic research experience having worked at IBM’s T.J. Watson Research Center, Intel’s Logic Technology Development, Emerson Network Power’s (ENP) Cooligy Precision Cooling, and the Materials Department of Ecole Polytechnique Federale de Lausanne (EPFL). His research interests include: Electronic Materials and Processing, Micro Cooling Devices, Wafer-Level Packaging, Joining Technologies, Electrochemical Processing, and Materials Characterization. Dr. Datta is an innovator with 48 issued US Patents.and is recipient of the Electrodeposition Research Award of the Electrochemical Society. Dr. Datta received his doctorate from the Materials Department of Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland. He was awarded with Ninth Plateau of IBM Invention Achievement Awards and IBM’s Top 5% Patent award. He has authored 90+ publications and is the author/editor of several books on Electrochemical Processing & Micro/Nano electronics. He is recipient of the Electrodeposition Research Award of the Electrochemical Society. International Biographical Center, Cambridge, England included his name in outstanding scientists of the 20th Century in honor of his outstanding contribution in the field of Electrochemical Microfabrication. He has held several administrative positions including divisional chairs in the Electrochemical Society and the International Society of Electrochemistry. He has organized several international symposia and has presented keynote and invited lectures.. Dr. Datta received his BS in Chemical Engineering from H.B. Technological Institute, Kanpur, MS from University of California at Los Angeles.

Research Interest

Electronic Materials: Micro/Nano Fabricated Tailored Materials and Structures for Microelectronic packaging; Flip-chip (C4) technology; Lead-free Packaging Materials. Materials Processing: Electrodeposition, Etching, Electropolishing, Anodization; Advanced Joining Processes for metal-metal, metal-ceramic bonding. Energy Technologies: Li-metal and Li-ion battery technologies for Electronics; Solar cells. Thermal Management: Energy Efficient Liquid Cooling Systems for Electronic and Photonic Devices; Micro-Heat Exchanger and Micro-Fluidics devices.