Yogan

Biography

Yogan is the Vice President of Test Engineering at Tessolve and currently heads the Tessolve Coimbatore PCB Engineering Division. He has behind him 26 years of experience in the Semiconductor Test industry. Before joining Tessolve, Yogan was with Teradyne Asia Test Application Group, handling Test Engineering projects from Teradyne US and Europe. His experience includes providing Turnkey Test Solution for various Converters, GPS, Bluetooth, Wi-Fi and WiMax technologies. Yogan's earlier years were with Salland Engineering, National Semiconductor and SPEL where he was involved in Test Engineering that include Test Hardware, Test Program Development, Debug and Release to Production. He has presented papers on Test technique at various conferences including the TUG, Semicon and written articles in Test and Measurement World and Semiconductor Manufacturing. 

Research Interest

 engineering