Srinivas Chada

Biography

Srinivas Chada is senior principal engineer, Stryker. Prior to joining Stryker, Chada was component packaging engineer at Schlumberger HFE. Before that, Chada held senior-level managerial, engineering, and research positions in the fields of electronics reliability, failure analysis, materials science, and metallurgy at Whirlpool, Medtronic, Jabil, Honeywell Electronic Materials, and Motorola. Previously, Chada was chair of the Electronic Packaging and Interconnects Materials Committee for TMS and is presently the editor of the Journal of Surface Mount Technology for the Surface Mount Technology Association. Chada holds a Bachelor of Engineering (B.E.) in metallurgical engineering from the National Institute of Technology Karnataka (NITK), Srinivasanagar, India. He obtained his M.S. and Ph.D. in Material Science and Engineering from Marquette University, Milwaukee, Wisconsin, and completed his MBA at Hough Graduate School of Business, University of Florida, Gainesville, Florida. A member of TMS since 1988, Chada served as chair of the Electronic Packaging and Interconnection Materials Committee from 2005-2010. Recently, he has also served as a chair for the Functional Materials Division (FMD), a representative to the Publications Coordinating Committee for the FMD, and a JOM advisor.

Research Interest

Material Science and Engineering