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Mark Johnson


Electrical and Electronic Engineering
The University of Nottingham
United Kingdom

Biography

Professor C Mark Johnson received the BA degree in engineering and the PhD degree in electrical engineering from the University of Cambridge, UK, in 1986 and 1991 respectively. From 1990 to 1992 he was a Research Associate at the University of Cambridge and in 1992 he was appointed Lecturer at the University of Newcastle, UK, where his research included the design, analysis and characterisation of power semiconductor devices, resonant power conversion and instrumentation. From 1998 to 2001 he managed the UK national programme on Silicon Carbide electronics and in 2000 he became Reader of Power Electronics at the University of Newcastle. In 2003, Professor Johnson was appointed as Rolls-Royce/RAEng Research Professor of Power Electronic Systems at the University of Sheffield and in 2006 he was appointed to a personal chair at the University of Nottingham, where he leads research into power semiconductor devices, power device packaging, reliability, and thermal management, power module technologies and power electronic applications. He is a member of the executive committee of the UK Innovative Electronics Manufacturing Research Centre (IeMRC) and is Director of the EPSRC Centre for Power Electronics.

Research Interest

Professor Johnson is currently researching: Power semiconductor devices Power device packaging, reliability, and thermal management Power module technologies Power electronic applications Renewable energy technologies; distributed generation Thermoacoustics.

Publications

  • LI JF, AGYAKWA PA, JOHNSON CM. Kinetics of Ag3Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process Acta Materialia. 58(9): 3429-3443 .(2010).

  • MUSALLAM M, JOHNSON CM. Real-time compact thermal models for health management of power electronics IEEE Transactions on Power Electronics. 25(6): 1416-1425 .(2010).

  • AGYAKWA PA, CORFIELD MR, LI JF, LOH W, LIOTTI E, HOGG SC, JOHNSON CM. Unusual observations in the wear-out of high-purity aluminium wire bonds under extended range passive thermal cycling IEEE Transactions on Device and Materials Reliability. 10(2), 254-262 .(2010).

  • LI JF, AGYAKWA PA, JOHNSON CM. Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process Acta Materialia. 59(3), 1198-1211 .(2011).

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